November 12, 2025 In-Depth Analysis of Industrial PC Size Specifications

In-Depth Analysis of Industrial PC Size Specifications: How to Precisely Match 1U/2U/3U Rack-Mounted Models with Application Scenarios?

In industrial automation, data centers, edge computing, and other scenarios, rack-mounted industrial PC have become the preferred choice for core control equipment due to their advantages such as high-density deployment, unified management, and efficient heat dissipation. However, when faced with the three mainstream size specifications of 1U, 2U, and 3U, making the optimal choice based on dimensions such as space constraints, heat dissipation requirements, and expansion capabilities often becomes the key to successful project implementation. This article will provide an analysis from three perspectives: technical parameters, scenario adaptation, and selection misconceptions. It will also recommend the USR-EG628 industrial PC as a typical solution and finally provide access to customized chassis size adaptation solutions to help you efficiently complete system deployment.

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1. Analysis of Rack-Mounted Industrial PC Size Specifications: Core Differences Among 1U/2U/3U

1.1 Size Definitions and Industry Standards

According to the EIA (Electronic Industries Association) standard, the height of rack-mounted equipment is measured in "U" (Unit), where 1U = 1.75 inches (44.45 mm). The width is fixed at 19 inches (482.6 mm), while the depth varies depending on the design (usually 400-600 mm). The core parameter comparisons for the three specifications are as follows:

Specification
Height (mm)
Typical Depth (mm)
Applicable Scenarios
1U
44.45
400-500
High-density deployment, space-constrained environments
2U
88.9
450-550
Balanced expansion and heat dissipation requirements
3U
133.35
500-650
Complex expansion, high-performance computing

1.2 1U: The "Ultimate Pursuer" of Space Efficiency

Technical Characteristics:

  • Ultra-thin design: With a height of only 44.45 mm, it can deploy 42 devices in a standard 42U cabinet, increasing space utilization by 300%.
  • Heat dissipation challenges: Due to height limitations, it usually adopts an air-cooling + heat pipe design, requiring strict control of power consumption (recommended < 150W).
  • Limited expansion: Generally supports only 2-3 half-height PCIe slots or can achieve more functions through external expansion boxes.
    Applicable Scenarios:
  • Data centers: Virtualization servers, storage nodes, network switching equipment.
  • Telecom rooms: 5G base station controllers, edge computing gateways.
  • Compact control cabinets: Such as railway signal control and power dispatching systems.
    Case Study: A cloud computing service provider used 1U industrial PCs to deploy a virtualization platform, achieving a single-cabinet power density of 12 kW and saving 60% of space compared to traditional 3U solutions.

1.3 2U: The "All-Rounder" with Balanced Performance

Technical Characteristics:

  • Heat dissipation advantages: With a height increased to 88.9 mm, it can design a dual-fan heat dissipation system, supporting devices with a power consumption of 200-300W.
  • Flexible expansion: Usually provides 4-6 full-height PCIe slots, supporting GPUs, high-speed network cards, storage controllers, etc.
  • Convenient maintenance: Reserves sufficient space for hardware replacement and cable management, reducing the MTTR (Mean Time To Repair) by 40%.
    Applicable Scenarios:
  • Industrial automation: PLC control, machine vision, data acquisition and processing.
  • Enterprise applications: Database servers, firewalls, load balancing devices.
  • Testing and measurement: Multi-channel data loggers, high-frequency trading systems.
    Case Study: An automobile manufacturing plant used 2U industrial PCs to integrate a machine vision system, supporting 4 GigE Vision camera cards and achieving online inspection of 120 vehicles per minute.

1.4 3U: The "Performance Flagship" for Complex Expansion

Technical Characteristics:

  • Heat dissipation redundancy: With a height of 133.35 mm, it can design a triple-fan heat dissipation system, supporting high-performance devices with a power consumption > 500W.
  • Unlimited expansion: Provides 8-10 full-height PCIe slots, supporting multi-GPU parallel computing and high-speed storage arrays.
  • Reinforced structure: Usually adopts thickened steel plates (above 2 mm) with an anti-vibration rating of up to 5Grms (10-500 Hz).
    Applicable Scenarios:
  • High-performance computing: AI training, scientific simulations, financial quantitative trading.
  • Military and aerospace: Radiation-resistant and shock-resistant embedded control systems.
  • Multi-system integration: Simultaneously running virtual machines, containers, and real-time operating systems (RTOS).
    Case Study: An aerospace research institute used 3U industrial PCs to deploy a flight control system, integrating 12 IO modules and achieving millisecond-level response.

2. Three Core Principles for Selection: How to Avoid "Size Pitfalls"?

Principle 1: Space Priority vs. Performance Priority

Problem: A user chose a 1U solution to save cabinet space, but due to insufficient heat dissipation, the equipment frequently crashed, increasing annual maintenance costs by 80,000 yuan.
Solution:

  • Space-sensitive scenarios: Prioritize 1U, but control the total power consumption (recommended < 120W/device) and reserve a 20% heat dissipation margin.
  • Performance-sensitive scenarios: Prioritize 2U/3U to ensure that the heat dissipation system can cover the maximum power consumption of the equipment (e.g., GPU cards require additional heat dissipation).

Principle 2: Matching Expansion Requirements with Slot Quantities

Problem: An industrial control system initially selected a 2U (4-slot) solution. Later, it needed to add 2 motion control cards, but due to insufficient slots, it was forced to replace the 3U chassis, increasing costs by 30%.
Solution:

  • Short-term needs: Reserve slots based on the current number of peripherals + 1 (e.g., if 2 cards are currently needed, select a 3-slot 2U).
  • Long-term planning: Consider the expansion needs for the next 3-5 years. The 3U solution can support 10 cards, resulting in lower lifecycle costs.

Principle 3: Heat Dissipation Design and Environmental Adaptability

Problem: A steel plant deployed 1U industrial PCs in a high-temperature workshop (50°C), causing the motherboard to deform due to insufficient heat dissipation and shortening the equipment's lifespan by 60%.

Solution:
  • High-temperature environments: Choose 2U/3U solutions and equip them with independent heat dissipation air ducts or liquid cooling modules.
  • Dusty environments: Adopt positive pressure dust-proof designs (such as the IP50 protection level of the USR-EG628) to avoid dust accumulation.

3. USR-EG628 Industrial PC: The "Adaptation Expert" for All Sizes

3.1 Product Highlights: One Machine for Multiple Scenarios

Flexible Sizes:
  • 1U version: Depth of 450 mm, supports 2 full-height PCIe slots, power consumption < 150W.
  • 2U version: Depth of 500 mm, supports 6 full-height PCIe slots, power consumption < 300W.
  • 3U version: Depth of 600 mm, supports 10 full-height PCIe slots, power consumption < 500W.
    Industrial-Grade Design:
  • Heat dissipation system: 1U adopts a dual-fan + copper pipe heat dissipation design, while 2U/3U adopts a triple-fan redundant design.
  • Anti-vibration: Passes 5Grms vibration testing (10-500 Hz), suitable for vehicle-mounted/shipborne environments.
  • Wide temperature operation: Operates continuously from -20°C to 70°C, adapting to extreme scenarios such as outdoor base stations and polar expeditions.
    Intelligent Management:
  • BMC remote monitoring: Real-time monitoring of temperature, voltage, and fan speed, supporting the IPMI 2.0 protocol.
  • Fault prediction: Uses AI algorithms to predict the lifespan of hard drives and fans, issuing maintenance reminders 30 days in advance.

3.2 Scenario-Based Size Recommendations

Scenario 1: Data Center Edge Computing Node (High-Density Deployment)

Recommendation: 1U version
Configuration: 2 × PCIe x16 (GPU cards) + 1 × PCIe x4 (Gigabit network card)
Effect: Deploys 42 devices in a single cabinet, achieving a computing power density of 10 PFLOPS and a PUE (Power Usage Effectiveness) < 1.2.

Scenario 2: Intelligent Manufacturing Control Center (Multi-Peripheral Integration)

Recommendation: 2U version
Configuration: 4 × PCIe x8 (motion control cards) + 2 × PCIe x4 (data acquisition cards)
Effect: Supports 16-axis synchronous control with a data acquisition delay < 1 ms.

Scenario 3: AI Training Cluster (High-Performance Computing)

Recommendation: 3U version
Configuration: 8 × PCIe x16 (GPU cards) + 2 × PCIe x4 (NVMe storage)
Effect: Achieves an FP16 computing power of 500 TFLOPS, improving training efficiency by 3 times.


4. Customized Chassis Size Adaptation Solutions: Three Steps for Precise Matching

4.1 Solution Access Channels

Online Evaluation Tool: Visit the official website's "Chassis Size Adapter," input scenario parameters (such as "space height ≤ 500 mm" and "number of peripherals = 6 blocks"), and the system will automatically recommend the optimal size solution.
One-on-One Expert Consultation: Call the 400 customer service hotline and communicate environmental details (such as "temperature range -10°C to 55°C" and "vibration level 3Grms") with technical engineers to obtain a customized BOM list.
Sample Trial: Apply for a USR-EG628 sample (choose from 1U/2U/3U) and conduct a 7-day actual test to verify space utilization and heat dissipation performance.

4.2 Core Steps for Adaptation Solutions

Step 1: Space Measurement and Limitation Confirmation

Record the available height (U number), depth (mm), and width (whether it is a standard 19-inch) of the cabinet.
Confirm any special limitations (such as access control size and cable management space).

Step 2: Peripheral List and Expansion Requirements

List all peripherals to be installed (such as GPU cards, network cards, and storage modules), indicating their dimensions (length × width × height) and power consumption.
Calculate the total slot requirements (such as "needing 6 full-height PCIe slots").

Step 3: Heat Dissipation and Environmental Adaptability Verification

Based on the environmental temperature (such as "40°C continuous operation"), select a heat dissipation solution (1U requires enhanced air cooling, while 3U can support liquid cooling).
Confirm the vibration level (such as "vehicle-mounted environments require 5Grms anti-vibration") and select a reinforced chassis.

Contact Us: Usher in a New Era of Efficient Industrial Computing

In the wave of Industry 4.0 and intelligent transformation, every size mismatch can lead to deployment failures, and every insufficient heat dissipation can trigger system crashes. The USR-EG628 industrial PC provides you with an "out-of-the-box" chassis size adaptation solution with three core advantages: full-size coverage, industrial-grade reliability, and intelligent management.

Contact us to find out more about what you want !
Talk to our experts



Contact us to enjoy the following benefits:
Selection is just the first step; designing on-site applications according to your actual business needs is the key. We offer the following services:
Free Consultation: Recommend adaptation application solutions based on on-site application industry scenarios.
Sample Trial: Provide trial opportunities for high-end equipment such as the USR-EG628 to personally experience product stability.
Custom Development: Support personalized needs such as protocol expansion, interface customization, and private cloud integration.
Two-Year Warranty: 7×24-hour one-on-one technical support for worry-free after-sales service.
Contact us: Obtain the "Rack-Mounted Industrial PC Deployment and Operation" and USR-EG628 product manual.

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