Realization of IP65 Protection Level for Industrial PC: A Complete Solution from Chassis Sealing to Interface Dust Prevention
In industrial automation, intelligent manufacturing, and outdoor operation scenarios, industrial PCs must confront extreme environmental challenges such as dust, humidity, and high-pressure water jets. The IP65 protection level, as an internationally recognized standard for dust and water resistance, requires devices to achieve "complete dust protection" and "protection against low-pressure water jets," becoming a core indicator for ensuring stable device operation. This article will analyze the complete technical path for IP65 protection from three key dimensions—chassis sealing structure, interface dust prevention design, and heat dissipation-protection balance—combined with industry practice cases, and explore how to address customer pain points through systematic design.

1. Chassis Sealing: Full-Link Protection from Materials to Processes
1.1 Selection of Sealing Materials: Balancing Strength and Weather Resistance
Industrial PC chassis must withstand vibration, impact, and drastic temperature changes, requiring sealing materials to meet the following requirements:
High Elasticity: Materials such as silicone rubber and ethylene propylene diene monomer (EPDM) rubber can maintain elasticity within a wide temperature range of -40°C to 85°C, preventing sealing failure due to thermal expansion and contraction.
Corrosion Resistance: In chemical and marine environments, fluororubber or polytetrafluoroethylene (PTFE) coatings are selected to resist salt spray and acid-base erosion.
Aging Resistance: By adding antioxidants and ultraviolet absorbers, the material's service life can be extended to over 10 years.
Case Study: The Changfeng Zhiyuan A1-FT-Pro fully rugged tablet adopts silicone edging and waterproof adhesive strips, achieving 72 consecutive hours of no leakage during high-pressure water jet testing on oil drilling platforms, far exceeding IP65 standard requirements.
1.2 Sealing Structure Design: Eliminating Microscopic Leakage Paths
Integral Structure: Reducing the number of seams, such as using die-cast aluminum alloy chassis with CNC machining for one-piece forming to avoid joint gaps.
Multi-Stage Sealing: Adopting a "seal ring + drainage channel" design at critical areas such as interface covers and cooling vents, ensuring that even if a small amount of liquid penetrates, it will be drained along the drainage channel.
Pressure Balancing: Installing a breathable valve inside the chassis to balance internal and external air pressure, preventing sealing failure due to pressure differences.
Technological Breakthrough: Suzhou Fulongte's patented dustproof slot uses movable sealing components on both sides of the protective cover to dynamically adjust the opening area, achieving intelligent balance between dust prevention and heat dissipation. Its breathable holes use micron-level filters to intercept particles above 0.3μm while maintaining air circulation.
1.3 Manufacturing Process Control: Ensuring Sealing Consistency
Laser Welding: Replacing traditional mechanical fastening to eliminate leakage points such as screw holes.
Automated Glue Application: Using robots to control the sealing glue application path and thickness, with an error margin within ±0.1mm.
Air Tightness Testing: Using helium mass spectrometer leak detectors to conduct 100% testing on each device, with a leakage rate below 1×10⁻⁹ Pa·m³/s.
Industry Data: After introducing laser welding processes, a certain automotive electronics manufacturer reduced equipment failure rates from 3.2% to 0.5%, saving 2 million yuan in annual maintenance costs.
2. Interface Dust Prevention: From Passive Isolation to Active Protection
2.1 Data Interface Protection: Balancing Dust Prevention and Usability
Flip-Up Protective Covers: Such as the patented design by Gansu Guoxin, which uses a spring mechanism for automatic rebound, maintaining sealing when interfaces are idle.
Magnetic Interface Covers: Reducing mechanical plugging and unplugging wear while using magnetic attraction to keep interface covers closed.
Self-Cleaning Interfaces: Installing micro-brushes inside interfaces to automatically remove dust during plugging and unplugging.
Scenario Adaptation: In wind farm inspection scenarios, devices require frequent plugging and unplugging of sensor interfaces. Industrial PCs with magnetic interface covers can avoid contact failures due to dust accumulation, increasing data collection success rates to 99.9%.
2.2 Cooling Vent Protection: Optimizing Between Protection and Efficiency
Honeycomb Hole Arrays: By reducing individual hole diameters (usually ≤0.5mm) and increasing hole density, dust is blocked while maintaining heat dissipation efficiency.
Labyrinth Air Ducts: Causing airflow to make multiple turns inside the chassis, causing dust to deposit on the duct walls due to inertia.
Electrostatic Dust Removal: Installing charged filters in front of cooling fans to adsorb dust through static electricity, with periodic cleaning via reverse pulse.
Technological Comparison:
Protection Method Dust Prevention Efficiency Heat Dissipation Efficiency Cost
Honeycomb Hole Arrays 95% 90% Low
Labyrinth Air Ducts 98% 85% Medium
Electrostatic Dust Removal 99.9% 95% High
2.3 Button and Indicator Protection: Details Determine Reliability
Silicone Buttons: Achieving dust and water resistance with IP68-rated buttons while maintaining tactile feedback.
Light Guide Design: Transmitting indicator lights through transparent light guides to the panel, avoiding panel openings.
Touchscreen Replacement for Physical Buttons: Using capacitive touchscreens in outdoor devices to reduce mechanical structures.
Case Study: The Emdoor P10A industrial tablet, applied in food processing plants, replaced physical buttons with a touchscreen, eliminating button gaps and achieving full IP65 protection, reducing annual device cleaning time by 40 hours.
3. Balancing Heat Dissipation and Protection: Systematic Design is Key
3.1 Thermal Simulation Optimization: Accurately Predicting Temperature Fields
Through CFD (Computational Fluid Dynamics) simulation, airflow distribution and temperature fields inside the chassis are simulated to optimize cooling vent positions, fan speeds, and heat sink layouts. For example, in the design of the USR-EG628 industrial PC, simulation determined the optimal air duct direction, reducing core component temperatures by 15°C compared to traditional designs.
3.2 High-Efficiency Heat Dissipation Materials: Breaking Physical Limits
Graphene Heat Sinks: With a thermal conductivity of 5300 W/m·K, over 10 times that of copper.
Heat Pipe Technology: Achieving long-distance efficient heat dissipation through phase-change heat transfer.
Liquid Cooling Modules: Removing heat through circulating coolant in extreme high-temperature scenarios.
Data Support: After applying liquid-cooled industrial PCs in a certain steel plant, continuous operation time in 60°C environments increased from 2 hours to 24 hours.
3.3 Intelligent Temperature Control Systems: Dynamically Adjusting Heat Dissipation Strategies
Temperature Sensor Networks: Deploying sensors at key areas such as CPUs, GPUs, and hard drives for real-time temperature monitoring.
PID Control Algorithms: Dynamically adjusting fan speeds based on temperature changes to balance heat dissipation and noise.
Fault Warning: Automatically reducing frequency and sending alarm messages when temperatures approach thresholds.
USR-EG628 Practice: The device incorporates a three-level temperature control system, automatically switching heat dissipation modes in environments ranging from -40°C to 85°C, ensuring stable operation of AI computing modules.
4. USR-EG628: The Industrial Computing Hub with IP65 Protection
As a comprehensive and scalable ARM industrial computer, the USR-EG628 offers the following advantages in achieving IP65 protection:
Fully Sealed Design: Using die-cast aluminum alloy chassis and laser welding processes with no visible seams.
Interface Protection: Standard flip-up protective covers and magnetic interfaces, supporting 4G/5G/Wi-Fi/Ethernet multi-network backup.
Heat Dissipation Optimization: Continuous operation without frequency reduction in 60°C environments through graphene heat sinks and intelligent temperature control systems.
Edge Computing Capabilities: Built-in 1 TOPS AI computing power for local processing of image recognition, voice judgment, and other tasks, reducing cloud dependency.
Typical Application: In smart agriculture scenarios, the USR-EG628 controls water pumps and fans, collects temperature and humidity data, and withstands field dust and rain through IP65 protection, with an annual failure rate below 0.3%.
5. From Protection to Empowerment: The Deeper Value of IP65
IP65 protection is not just physical-level protection but also a "passport" for industrial PCs to extend into extreme environments. Through systematic design, enterprises can achieve:
Improved Production Continuity: Reducing downtime due to environmental factors, ensuring OEE (Overall Equipment Effectiveness).
Lower Maintenance Costs: Extending device lifespan and reducing spare part replacements and manual inspection frequencies.
Enhanced Data Reliability: Avoiding data collection errors or losses due to dust and humidity.
Action Recommendations: If your devices face the following challenges:
Dust causing interface contact failures;
Humid environments triggering circuit short circuits;
High-pressure cleaning damaging internal components;
Extreme temperatures affecting device performance.